| 1. | Rigid double - sided printed board
刚性多层印制板 |
| 2. | Printed boards . part 10 : specification for flex - rigid double - sided printed boards with through connections
印制板第10部分:有贯穿连接的刚挠双面印制板规范 |
| 3. | System of quality assessment - sectional specification - rigid double - sided printed boards with plated - through holes
质量评估体系.分规范.有镀通孔的刚性双面印制板 |
| 4. | Printed wiring boards - specification for flex - rigid double - sided printed boards with through connections
印制电路板.第10部分:贯穿连接的挠性-刚性双面印制电路板规范 |
| 5. | Printed boards ; part 10 : specification for flex - rigid double - sided printed boards with through connections
印制电路板.第10部分:有贯穿连接的弯曲刚性双面印制电路板规范 |
| 6. | System of quality assessment - sectional specification - flex - rigid double - sided printed boards with through - connections
质量评估体系.分规范.直通连接的软-硬性双面印制板 |
| 7. | System of quality assessment - capability detail specification - rigid double - sided printed boards with plated - through holes
质量评估体系.性能详细规范.带镀通孔的刚性双面印制板 |
| 8. | System of quality assessment - capability detail specification - flex - rigid double - sided printed boards with through - connections
质量评估体系.性能详细规范.直通连接的软-硬性双面印制板 |
| 9. | Printed boards ; part 10 : specification for flex - rigid double - sided printed boards with through connections ; identical with iec 60326 - 10 : 1991
印制电路板.第10部分:带贯穿连接的刚挠双面印制电 |
| 10. | Harmonized system of quality assessment for electronic components - capability detail specification : flex - rigid double - sided printed boards with through connections
电子元器件质量评估协调体系.性能详细规范:整体连接弯曲刚性双面多层印制电路板 |
